0
Курс ЦБ на 06.12.2025
$76,09
€88,7

Micron Technology MT16LSDT3264AG133G3

артикул MT16LSDT3264AG133G3
Micron Technology
производитель
DRAM Module SDRAM 256Mbyte 168UDIMM Tray
Datasheet PDF | 475 кб
По данному товару предложений не найдено. Оставьте заявку, и мы вам перезвоним.
Отправить запрос
Технические параметры
EU RoHS
Not Compliant
ECCN (US)
EAR99
Part Status
Obsolete
HTS
8542.32.00.28
Automotive
No
PPAP
No
Module
DRAM Module
Subcategory
SDRAM
Module Density
256Mbyte
Organization
32Mx64
Module Type
168UDIMM
Number of Chip per Module
16
Chip Density (bit)
128M
Data Bus Width (bit)
64
Max. Access Time (ns)
6; 5.4
Maximum Clock Rate (MHz)
133
Chip Configuration
16Mx8
Minimum Operating Supply Voltage (V)
3
Typical Operating Supply Voltage (V)
3.3
Maximum Operating Supply Voltage (V)
3.6
Operating Current (mA)
1216
Minimum Operating Temperature (В°C)
0
Maximum Operating Temperature (В°C)
65
Supplier Temperature Grade
Commercial
ECC Support
No
Number of Ranks
Dual
CAS Latency
3
Packaging
Tray
Supplier Package
DIMM
Pin Count
168
Standard Package Name
DIM
Mounting
Socket
Package Height
35.05(Max)
Package Length
133.5(Max)
Package Width
3.99(Max)
PCB changed
168
Lead Shape
No Lead