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Курс ЦБ на 15.01.2026
$78,57
€92,2

Firefly CORE-3399J 2GB/32GB

артикул CORE-3399J 2GB/32GB
Firefly
производитель
Core-3399J Hexa-Core High Performance Core Board ...
Datasheet PDF | 4 мб
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Описание

Core-3399J Hexa-Core High Performance Core Board

The Rockchip RK3399 series, a flagship processor, features a hexa-core 64-bit ARM architecture and 4K video decoding. The core board offers diverse display interfaces, including HDMI 2.0, MIPI-DSI, eDP 1.3, and DP 1.2, achieving dual displays. Additionally, it provides multiple peripheral interfaces such as Gigabit Ethernet, PCIe, USB 3.0, Type-C, and MIPI-CSI.The device ensures reliable operation within a wide temperature range from -20°C to 70°C for uninterrupted 24/7 performance. This core board is widely used in industrial computers, edge computing, computer vision, self-service terminals, all-in-one digital signage, cloud servers, and more.

Specifications

Core-3399J (Commercial) Core-3399KJ (Industrial)
Basic Specifications CPU

RK3399

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 1.8 GHz

RK3399K

Hexa-core 64-bit (Cortex-A72×2 + Cortex-A53×4) processor,

up to 2.0 GHz

GPU

Mali-T860 MP4 quad-core GPU, Support OpenGL ES1.1/2.0/3.0/3.1, OpenVG1.1, OpenCL, DX11

Support AFBC (Frame Buffer Compression)

ISP

Built-in dual hardware ISP, Support up to single 13M pixel or dual 8M pixel

VPU

Hardware decoding: 4K@60fps H265/H264/VP9 decoding, multi-format decoding of 1080P videos (VC-1, MPEG-1/2/4, VP8)

Hardware encoding: 1080P H.264/AVC/VP8

Video post-processing: deinterlacing, noise reduction, edge/detail/color optimization

RAM

LPDDR4 (2GB/4GB optional)

Storage

eMMC(16GB/32GB/64GB/128GB optional)

Power

5V (voltage tolerance ± 5%)

Interface

Gold finger (314 Pin, MXM3.0, 0.5mm pitch)

OS

Android and Linux OS

Size

82mm * 63mm

Environment

Operating temperature: -20℃~60℃

Operating humidity: 10%~90%RH (non-condensing)

Operating temperature: -20℃~70℃

Operating humidity: 10%~90%RH (non-condensing)

Interface Specifications Network

Integrated with GMAC/SDIO 3.0/USB 3.0, the core board enables expansion for Gigabit Ethernet,

2.4G Hz/5G Hz dual-band WiFi/Bluetooth, and 3G/4G LTE.

Video Input

2 * MIPI-CSI (4 lanes)

1 * DVP (supporting up to 5M pixel)

Video Output

1 * HDMI 2.0, supports 4K@60fps output and HDCP 1.4/2.2

1 * MIPI-DSI, supports single-channel 2560 * 1600@60fps output

1 * eDP 1.3 (4 lanes with 10.8Gbps)

1 * DP 1.2 (DisplayPort), supports up to 4K*2K@60Hz resolution (output from the Type-C)

* Support dual-display

Audio Output

1 * SPDIF, 3 * I2S (I2S0/I2S2 supporting 8-channel input/output and I2S2 providing audio output for HDMI/DP)

USB

2 * USB2.0 、2 * USB3.0

PCIe

1 * PCIe2.1

Other

8*I2C、8*SPI、5*UART、5*ADC 、5*PWM 、1 * SDMMC、GPIOs