Powered by Rockchip RK3588 new-gen 8-core 64-bit processor, thecore board can be configured with up to 32GB RAM. Capable of 8K video encoding and decoding, it provides abundant interfaces supporting multiple hard disks, Gigabit Ethernet, WiFi6, 5G/4G expansion and a variety of video input and output. It also supports various operating systems. This core board can be used in ARM PC, edge computing, cloud server, smart NVR and other fields.

Specifications

Basic Specifications
SOC	RockChip RK3588
CPU	8-core 64-bit (4×Cortex-A76+4×Cortex-A55) , 8nm lithography process, frequency up to 2.4GHz
GPU	ARM Mali-G610 MP4 quad-core GPU Supports OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS
NPU	NPU computing power is up to 6 TOPS, Supports INT4/INT8/INT16 mixed operation, Supports framework switching of TensorFlow / MXNet / PyTorch / Caffe / etc.
ISP	Integrated 48MP ISP with HDR&3DNR
VPU	Video decoding: 8K@60fps H.265/VP9/AVS2 8K@30fps H.264 AVC/MVC 4K@60fps AV1 1080P@60fps MPEG-2/-1/VC-1/VP8 Video encoding: 8K@30fps encoding, Supports H.265 / H.264 * Achieves up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding
RAM	4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional)
Storage	16GB/32GB/64GB/128GB eMMC
Hardware Specifications
Network	Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet, WiFi 6/Bluetooth, 5G/4G LTE
Display	Video output: 2×HDMI2.1（8K@60fps or 4K@120fps，Combo with eDP (4K@60fps) ） 2×MIPI-DSI（4K@60fps） 2×DP1.4（8K@30fps，Combo with USB 3.0） 1×BT.1120（1080P@60fps） Video input: 1 × HDMI-IN ( 4K@60fps) , supports HDCP 2.3 1 × MIPI CSI (4 lanes) or 2×MIPI CSI (2 lanes) 2 × MIPI DC ( 4-lane DPHY v2.0 or 3-lane CPHY V1.1) 1 × DVP camera (up to 150MHz input data) * Supports multi-channel 8K video output and 4K video input, up to seven-screen output with different displays
Audio	2 × 8-channel I2S 2 × 2-channel I2S 2 × SPDIF 2 × 8-channel PDM (supports multi-MIC array) 1 × Dual-channel digital audio codec (16-bit DAC) 1 × VAD
PCIE	PCIe3.0 (2×2lanes,1×4lanes,4×1lanes) 、3×PCIE2.0(1 lanes)
SATA	3 × SATA3.0
USB	3 × USB3.0、4 × USB2.0 Host 2 × USB2.0 OTG
Power	4V (error±5%)
Other Interfaces	9 × I2C、10 × UART、5 × SPI、7 × ADC 、16 × PWM 、1 × SDMMC、GPIO
OS/Software
OS	Android: Android 12.0 Linux: Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux, Kylin Linux, UOS * Supports UEFI Boot
General
Size	82 mm × 53 mm
Interface Type	MXM3.0 ( 314 PIN, 0.5mm pitch)
PCB	10-layer design, immersion gold technology
Heat Dissipation	Heat sink installation hole pitch: 45mm
Power Consumption	Idle: ≈1.35W (12V/110mA) Typical: ≈4.8W (12V/400mA) Max: ≈20W (12V/1700mA)
Environment	Operating Temperature: -20℃-60℃, Storage Temperature: -20℃-70℃, Storage Humidity: 10%-80%