Process Technology
TrenchFET
Number of Elements per Chip
1
Maximum Drain Source Voltage (V)
30
Maximum Gate Source Voltage (V)
В±12
Maximum Gate Threshold Voltage (V)
1.5
Operating Junction Temperature (В°C)
-55 to 150
Maximum Continuous Drain Current (A)
3.1
Maximum Gate Source Leakage Current (nA)
100
Maximum Drain Source Resistance (mOhm)
68@4.5V
Typical Gate Charge @ Vgs (nC)
3@4.5V; 6.5@10V
Typical Gate Charge @ 10V (nC)
6.5
Typical Gate to Drain Charge (nC)
0.5
Typical Gate to Source Charge (nC)
0.8
Typical Reverse Recovery Charge (nC)
5
Typical Input Capacitance @ Vds (pF)
320@15V
Typical Reverse Transfer Capacitance @ Vds (pF)
19@15V
Minimum Gate Threshold Voltage (V)
0.6
Typical Output Capacitance (pF)
45
Maximum Power Dissipation (mW)
1100
Typical Fall Time (ns)
11
Typical Rise Time (ns)
15
Typical Turn-Off Delay Time (ns)
20
Typical Turn-On Delay Time (ns)
10
Minimum Operating Temperature (В°C)
-55
Maximum Operating Temperature (В°C)
150
Maximum Power Dissipation on PCB @ TC=25В°C (W)
1100
Maximum Pulsed Drain Current @ TC=25В°C (A)
15
Maximum Junction Ambient Thermal Resistance on PCB (В°C/W)
115
Typical Diode Forward Voltage (V)
0.8
Typical Gate Plateau Voltage (V)
1.8
Typical Reverse Recovery Time (ns)
11
Maximum Diode Forward Voltage (V)
1.2
Minimum Gate Resistance (Ohm)
0.6
Maximum Gate Resistance (Ohm)
6.4
Maximum Positive Gate Source Voltage (V)
12
Maximum Continuous Drain Current on PCB @ TC=25В°C (A)
3.1
Standard Package Name
SOT